Kategorie

Nowe produkty

Wszystkie nowe produkty

Promocje

  • ASI-10A
    ASI-10A

    Antystatyczna opaska na rękę....

    8,90zł 12,90zł
Wszystkie promocje
> Naprawy i Montaż w technologii SMT>Konwekcyjne Piece Komorowe>Piece Komorowe Konwekcyjne do lutowania płyt >X-REFLOW306-LF

X-REFLOW306-LF

X-REFLOW306-LF

X-REFLOW306-LF

Piec komorowy do lutowania bezołowiowego.      

Prosimy o przesłanie zapytania cenowego.

Zapytaj

Więcej informacji   

Sprawdź więcej szczegółów

Więcej szczegółów

Nie ma przypisanych żadnych punktów lojalnościowych do tego produktu.

4 inne produkty w tej samej kategorii:

Więcej informacji

- Możliwość podłączenia do PC w celu aktualizacji oprogramowania i śledzenia w czasie rzeczywistym procesu lutowania.
- Niezależna kontrola grzałki przedniej i tylniej.
- Przeszklone wieko umożliwia obserwację procesu.
- Maksymalna temperatura pieca to 350°C.
- Przystosowany do użycia azotu (N2).
- Konstrukcja pieca jest dobrze przemyślana dzięki czemu piec mieści się na stole lub specjalnie dla niego zaprojektowanym wózku antystatycnym.
- Waga: 43kg.
- Piec ma duży wyświetlacz LCD oraz pamięć do zapisania 245 profili.

Reflow area

12”x12”x1.75” (305x305x45 mm)

Temperature range

50°C to 350°C

 

Number of Zones

Purging, to push oxygen out + variable, three to five zones, set by the operator for each program.

Last zone is a cooling zone. So the oven can have 3 zones or 5 zones.

Heaters

2 Heaters (Front and Rear) 3,1kW (230V) and 3.1KW (208V)

Max. PCB size

12”x12” (306x306 mm)

Supply Requirements

25 amps, 230V 50/60 Hz (Max power consumption: 6 kW)

 

Advanced Cooling Module (Removable to ease maintenance, or to gain extra

½” of chamber height if it is needed occasionally)

Cooling media: Nitrogen or Shop Air. Timing and object temperature to cool to, is defined by the operator in the program.

Cooling media enters through small holes in the array of tubes located under the heated object. Advanced cooling produces more reliable soldering connections and helps to handle heated objects after heating cycle.

Opening and closure of the exhaust port is controlled by the programming. (This option is not included in the X-Reflow306 LF Models)

Monitoring Window Size

9.84”x9.84” (280×280 mm)

Nitrogen Connection

Standard Connector. Nitrogen pressure:1/2-1bar (7-14.5 psi)

Size

L=30”xW=20”xH=12” (L=480mm x W=711mm x H=200mm)

Weight (unpacked)

100lbs. (~43 kg)

Computer profile control

Allows pre-programming, storage and recall of up to 255 programs

Communication with PC

RS485 port (X485-USB converter is included with the oven to connect to PC’s USB port)

 

 

 

 

 

 

 

 

 

 

 

 

 

Advanced Features

·           Display of the actual temperature/time numerically or as a graph and full indication of set functions and process parameters along with their values in the Process Window.

 

·           Independent off-set for the 2 heaters, (useful when processing unevenly loaded boards).

 

·           RS-485 port for downloading firmware upgrades from a PC and monitoring air and two additional “K” Thermocouples during reflow process. (X-KAR R485-USB Converter is needed for connection to a PC and X306 Oven Monitor Software for monitoring and displaying on a PC real temperatures during the heating cycle. X-KAR XTC-Profiler (Eight TC inputs) is also recommended for multi-point monitoring.

 

·           Ready to solder in Nitrogen environment.

 

·           Means to monitor the process in progress (besides the on board LCD display)

 

·           Power at Max Mode, which allows for pre-setting a pre-reflow temperature of the heated object and a maximum temperature of this object by means of control of the heating by the “K” thermocouple attached to the heated object and the TC-B socket at the back of the unit.

 

·           Build-in heat exchanger for extraction of hot fumes after the heating cycle ends, to protect standard fume extraction systems against melting of their filters during the filtration process.